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 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L
PACKAGE
HSR412
HSR412L
SCHEMATIC
ANODE 1
6 DRAIN
6 6 1 1
CATHODE 2
5
N/C 3
4 DRAIN
DESCRIPTION
The HSR312 and HSR412 devices consist of a AlGaAs infrared emitting diode optically coupled to a power MOSFET detector which is driven by a photovoltaic generator. The devices are housed in a 6-pin dual-in-line package. The HSR312L and HSR412L employ an active current limit circuitry enabling the device to withstand current surge transients.
FEATURES
* 4,000 VRMS Isolation * Wide operating voltage range - 250 V (HSR312, HSR312L) - 400 V (HSR412, HSR412L) * Solid-State Reliability * Bounce-Free Operation * 4000 V ESD Rating (HBM) * UL, CSA and BABT approval pending
APPLICATIONS
* On/Off Hook Switch * Dial Out Relay * General Switching * * * Replacement for Mechanical Relays Ring Injection Relay Ground Start
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted)
Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Isolation Surge Voltage Maximum Input/Output Capacitance Maximum Input/Output Resistance TSTG TOPR TSOL VISO CIO RIO All All All All All All -40 to +100 -40 to +85 260 for 10 sec 4000 1.0 1012 C C C Vac(RMS) pF Symbol Device Value Units
(c) 2003 Fairchild Semiconductor Corporation
Page 1 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L HSR412 HSR412L
ELECTRICAL CHARACTERISTICS (TA = -40C to +85C Unless otherwise specified) INPUT CHARACTERISTICS
Parameters/Test Conditions Control Current Control Current for Off-State Resistance Control Current Range Reverse Voltage Forward Voltage (IF=10 mA) Connection Series or Parallel Series or Parallel Series or Parallel Series or Parallel Series or Parallel Symbol IF(ON) IF(OFF) IF VR VF Limit Max Min Min Max Min Max HSR312 2.0 0.4 2.0 25 7 1.6 HSR312L 2.0 0.4 2.0 25 7 1.6 HSR412 3.0 0.4 3.0 25 7 1.6 HSR412L 3.0 0.4 3.0 25 7 1.6 Units mA mA mA V V
OUTPUT CHARACTERISTICS
Parameters / Test Conditions Operating Voltage Range Connection Series or Parallel Symbol Limit HSR312 HSR312L HSR412 HSR412L VOPR IL Max Max Max Max RON Max Max Min Max Min Max Max 250 190 320 10 3 1.0 N/A N/A N/A N/A 3.0 250 170 300 15 4.25 1.0 190 300 330 560 3.0 400 140 210 27 7 1.0 N/A N/A N/A N/A 2.0 400 120 200 35 9 1.0 130 220 260 440 2.0 mA Units VDC or VAC(PEAK)
Load Current Series TA = +40C, 5mA control Parallel (see fig. 1 & 2) On-State Resistance Series TA = 25C, 50mA pulsed load, Parallel 5mA control Off-State Leakage Current TA = 25C, 250V for HSR312/L, Series or Parallel 400V for HSR412/L Current Limit TA = +25C, 5mA control Turn-On Time TA = +25C for 50mA, 100VDC load, 5mA control Turn-Off Time TA = +25C for 50mA, 100VDC load, 5mA control Thermal Offset Voltage 5mA control Output Capacitance 5VDC Series
--
A
ILMT Parallel
mA
Series or Parallel
TON
mS
Series or Parallel
TOFF -- CO
Max
0.5
0.5
0.5
0.5
mS
Series or Parallel Series or Parallel
Max Max
N/A 50
N/A 50
0.5 12
0.5 12
mV pF
ISOLATION CHARACTERISTICS
Characteristics Input-Output Isolation Voltage Test Conditions Symbol VISO Limit Max HSR312 4000 HSR312L 4000 HSR412 4000 HSR412L 4000 Units V
(c) 2003 Fairchild Semiconductor Corporation
Page 2 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312
20.0 17.5
HSR312L
2
HSR412
HSR412L
Figure 1. Forward Current vs. Forward Voltage
NORMALIZED ON RESISTANCE, R ON ()
Figure 2. Normalized on Resistance vs. Ambient Temperature
Series Connection 5mA Control ID = 10mA Normalized at 25C HSR312L
FORWARD CURRENT, IF (mA)
15.0 12.5 85C 10.0 7.5 5.0 2.5 0.0 1.0 1.1 1.2 1.3 1.4 1.5 25C -40C
HSR312 1
0 -40 -20 0 20 40 60 80 100
FORWARD VOLTAGE, VF (V)
AMBIENT TEMPERATURE, TA (C)
Figure 3. Normalized on Resistance vs. Ambient Temperature
2
250
Figure 4. Load Current vs. Voltage Drop
Series Connection 5mA Control @25C, pulsed
NORMALIZED ON RESISTANCE, R ON ()
Series Connection 5mA Control ID = 10mA Normalized at 25C
200
LOAD CURRENT, IDD (mA)
HSR412L
HSR312
150 100 50 0 -50 -100 -150 -200 HSR312L
HSR412
1
0 -40 -20 0 20 40 60 80 100
-250 -3 -2 -1 0 1 2 3
AMBIENT TEMPERATURE, TA (C)
VOLTAGE DROP, VDD (V)
Figure 5. Load Current vs. Voltage Drop
200
Series Connection 5mA Control @25C, pulsed
Figure 6. Maximum Load Current Vs Ambient Temperature
202 200 Vdd = 4V Series Connection HSR312
Maximum Load Current, I dd (mA)
198 196 194 192 190 IF = 5mA 188 186 184 182 IF = 2mA
LOAD CURRENT, IDD (mA)
100
0
HSR412L
-100
HSR412
-200
-4
-2
0
2
4
0
20
40
60
80
VOLTAGE DROP, VDD (V)
Ambient Temperature, TA (C)
(c) 2003 Fairchild Semiconductor Corporation
Page 3 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312
200
HSR312L
145 140 135 130 125
HSR412
HSR412L
Figure 7. Maximum Load Current Vs Ambient Temperature
Vdd = 4V Series Connection HSR312L
Figure 8. Maximum Load Current Vs Ambient Temperature
Vdd = 4V Series Connection HSR412
Maximum Load Current, I dd (mA)
180
160 IF = 5mA
Maximum Load Current, I dd (mA)
140 IF = 2mA
IF = 5mA 120 115 IF = 3mA 110
120
100 0 20 40 60 80 100
105 0 20 40 60 80
Ambient Temperature, TA (C)
Ambient Temperature, TA (C)
Figure 9. Maximum Load Current Vs Ambient Temperature
125 Vdd = 4V
1000
Figure 10. Off State Current vs. Ambient Temperature
Series Connection HSR412L
Maximum Load Current, I dd (mA)
120
OFF STATE CURRENT, IOFF (nA)
115
100
110 IF = 5mA 105 IF = 3mA 100
HSR312/L 10
95 0 20 40 60 80
1 -40 -20 0 20 40 60 80 100
Ambient Temperature, TA (C)
AMBIENT TEMPERATURE, TA (C)
Figure 11. Off State Current vs. Ambient Temperature
1000
100
Figure 12. Normalized Off State Leakage vs. Ambient Temperature
OFF STATE CURRENT, IOFF (nA)
100
ID-OFF/ID-OFF @25C
HSR312/L
10
HSR412/L 10
1
1 -40 -20 0 20 40 60 80 100
0.1 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE, TA (C)
AMBIENT TEMPERATURE, TA (C)
(c) 2003 Fairchild Semiconductor Corporation
Page 4 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L HSR412 HSR412L
Figure 13. Normalized Off State Leakage vs. Ambient Temperature
100
ID-OFF/ID-OFF @25C
10
HSR412/L 1
0.1 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE, TA (C)
Series Connection
1 + 2 5 AC or DC 6
LOAD
3
4
Parallel Connection
1 + LOAD 2 5 6 +
3
4
(c) 2003 Fairchild Semiconductor Corporation
Page 5 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L HSR412 HSR412L
Package Dimensions (Through Hole)
0.350 (8.89) 0.320 (8.13)
Package Dimensions (Surface Mount)
0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
0.390 (9.90) 0.332 (8.43)
0.070 (1.77) 0.040 (1.02)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25) 0.320 (8.13)
0.320 (8.13) 0.014 (0.36) 0.010 (0.25)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.006 (0.16)
Recommended Pad Layout for Surface Mount Leadform
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
NOTE All dimensions are in inches (millimeters)
(c) 2003 Fairchild Semiconductor Corporation
Page 6 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L HSR412 HSR412L
ORDERING INFORMATION
Option S SR2 Order Entry Identifier S SR2 Description Surface Mount Lead Bend Surface Mount; Tape and reel
Carrier Tape Specifications ("D" Tapin Orientation)
12.0 0.1 4.5 0.20 2.0 0.05 0.30 MAX 4.0 0.1 O1.5 MIN 1.75 0.10
11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3
0.1 MAX
10.1 0.20
O1.5 0.1/-0
User Direction of Feed
NOTE All dimensions are in inches (millimeters)
Reflow Profile
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak
230C, 10-30 s
Time above 183C, 120-180 sec Ramp up = 2-10C/sec * Peak reflow temperature: 245C (package surface temperature) * Time of temperature higher than 183C for 120-180 seconds * One time soldering reflow is recommended 3.5 4 4.5
3
Time (Minute)
(c) 2003 Fairchild Semiconductor Corporation
Page 7 of 8
1/28/03
PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
HSR312 HSR312L HSR412 HSR412L
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
Page 8 of 8
1/28/03


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